We present three resistive bridging fault models valid for different CMOS technologies. The models are partitioned into a general framework (which is shared by all three models) a...
In this paper, we analyze failing circuits and propose a multiple-fault diagnosis approach. Our methodology has been validated experimentally and has proved to be highly efficient...
For many large systems the computational complexity of complete model-based diagnosis is prohibitive. In this paper we investigate the speedup of the diagnosis process by exploiti...
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitio...
In this paper, we derive the X-half-perimeter wirelength (XHPWL) model for X-architecture placement and explore the effects of three different wire models on X-architecture plac...