- To date, most high-level synthesis systems do not automatically solve present design problems, such as those related to timing associated with the physical implementation of mult...
Ying Yi, Mark Milward, Sami Khawam, Ioannis Nousia...
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
In modular testing of system-on-a-chip (SoC), test access mechanisms (TAMs) are used to transport test data between the input/output pins of the SoC and the cores under test. Prio...
In a placed circuit, there are a lot of movable cells that can be flipped to further reduce the total wirelength, without affecting the original placement solution. We aim at solv...
Chiu-Wing Sham, Evangeline F. Y. Young, Chris C. N...
As the CMOS technology is scaled into the dimension of nanometer, the clock frequencies and die sizes of ICs are shown to be increasing steadily [5]. Today, global wires that requ...