226 search results - page 29 / 46 » Variation-tolerant circuits: circuit solutions and technique... |
ASPDAC
2005
ACM
13 years 10 months ago
2005
ACM
- To date, most high-level synthesis systems do not automatically solve present design problems, such as those related to timing associated with the physical implementation of mult...
ICCAD
2009
IEEE
13 years 6 months ago
2009
IEEE
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
DAC
2008
ACM
14 years 9 months ago
2008
ACM
In modular testing of system-on-a-chip (SoC), test access mechanisms (TAMs) are used to transport test data between the input/output pins of the SoC and the cores under test. Prio...
DAC
2006
ACM
14 years 9 months ago
2006
ACM
In a placed circuit, there are a lot of movable cells that can be flipped to further reduce the total wirelength, without affecting the original placement solution. We aim at solv...
ISPD
2004
ACM
14 years 1 months ago
2004
ACM
As the CMOS technology is scaled into the dimension of nanometer, the clock frequencies and die sizes of ICs are shown to be increasing steadily [5]. Today, global wires that requ...