—With the advancement of CMOS manufacturing process to nano-scale, future shipped microprocessors will be increasingly vulnerable to intermittent faults. Quantitatively character...
We have developed a function-level power estimation methodology for predicting the power dissipation of embedded software. For a given microprocessor core, we empirically build th...
Gang Qu, Naoyuki Kawabe, Kimiyoshi Usami, Miodrag ...
Modern high performance processors employ advanced techniques for thermal management, which rely on accurate readings of on-die thermal sensors. As the importance of thermal effec...
The emerging three-dimensional integrated circuit (3D IC) is beneficial for various applications from both area and performance perspectives. While the general trend in processor...
—The article describes a course on system design (structural approach) which involves the following: issues of systems engineering; structural models; basic technological problem...