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94
Voted
VTS
2008
IEEE
15 years 9 months ago
2008
IEEE
Unlike the top-down photolithographic CMOS VLSI process, cost-effective bulk fabrication of nanodevices calls for a bottom-up approach, generally called self-assembly. Selfassembl...
112
Voted
DATE
2007
IEEE
15 years 8 months ago
2007
IEEE
— It has been the conventional assumption that, due to the superlinear dependence of leakage power consumption on temperature, and widely varying on-chip temperature profiles, a...
108
Voted
ICC
2007
IEEE
15 years 8 months ago
2007
IEEE
Abstract— Despite primary space-time coding where the channel state information (CSI) is available at the receiver only, the capacity and performance of multiple-input multiple-o...
118
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ICCAD
2007
IEEE
15 years 8 months ago
2007
IEEE
—In latency-insensitive design shell modules are used to encapsulate system components (pearls) in order to interface them with the given latency-insensitive protocol and dynamic...
130
Voted
ICDE
2007
IEEE
15 years 8 months ago
2007
IEEE
With the proliferation of multimedia data and evergrowing requests for multimedia applications, new challenges are emerged for efficient and effective managing and accessing large...