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NANONET
2009
Springer
199views Chemistry» more  NANONET 2009»
14 years 1 months ago
Through Silicon Via-Based Grid for Thermal Control in 3D Chips
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
José L. Ayala, Arvind Sridhar, Vinod Pangra...
WASA
2009
Springer
103views Algorithms» more  WASA 2009»
14 years 1 months ago
Void Avoidance in Three-Dimensional Mobile Underwater Sensor Networks
Mobile underwater sensor networks are usually featured with three-dimensional topology, high node mobility and long propagation delays. For such networks, geographic routing has be...
Peng Xie, Zhong Zhou, Zheng Peng, Jun-Hong Cui, Zh...
CONTEXT
2001
Springer
14 years 1 months ago
Local Holism
Abstract. This paper is devoted to discuss a general tendency in contextualism which is known as "radical contextualism". In the first part I state the well known paradox...
Carlo Penco
DFG
2001
Springer
14 years 1 months ago
Interactive medical 3D-simulations by means of stereoscopy and standard hardware
: Using stereo-3D hardware in its different solutions is not new, but most available applications use these Hardware only for a better visualization of 3d-reconstructions. It is an...
Kay Melzer, Hans-Gerd Lipinski, Dietrich H. W. Gr&...
ICSE
2001
IEEE-ACM
14 years 1 months ago
Using Transformation Systems for Software Maintenance and Reengineering
Software maintenance costs dominate software engineering costs, partly because most such engineering is done manually. Program Transformation tools leverage an engineer-provided b...
Ira D. Baxter
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