Abstract. Software engineering activities in the Industry has come a long way with various improvements brought in various stages of the software development life cycle. The comple...
R. Selvarani, T. R. Gopalakrishnan Nair, Muthu Ram...
Chemical-mechanical planarization (CMP) and other manufacturing steps in very deep-submicron VLSI have varying effects on device and interconnect features, depending on the local ...
In this paper we describe a new shape-from-shading method. We show how the parallel transport of surface normals can be used to impose curvature consistency and also to iterativel...
This paper presents a new 3-D subband coding framework that is able to achieve a good balance between high compression performance and channel error resilience. Various data transf...
In many multiclass learning scenarios, the number of classes is relatively large (thousands,...), or the space and time efficiency of the learning system can be crucial. We invest...