— As the feature size of transistors gets smaller, fabricating them becomes challenging. Manufacturing process follows various corrective design-for-manufacturing (DFM) steps to ...
Aggressive technology scaling into the nanometer regime has led to a host of reliability challenges in the last several years. Unlike onchip caches, which can be efficiently prot...
Amin Ansari, Shuguang Feng, Shantanu Gupta, Scott ...
A three-dimensional (3D) CMOS imager constructed by stacking a pixel array of backside illuminated sensors, an analog-to-digital converter (ADC) array, and an image signal process...
This paper1 discusses a defect tolerant and energy economized computing array for the DSP plane of a 3-D Heterogeneous System on a Chip. We present the J-platform, which employs c...
We propose a novel system-level error tolerance approach specifically targeted for multimedia compression algorithms. In particular we focus on the motion estimation process perf...