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SDM
2004
SIAM
13 years 11 months ago
2004
SIAM
It has long been known that Dynamic Time Warping (DTW) is superior to Euclidean distance for classification and clustering of time series. However, until lately, most research has...
ICCD
2004
IEEE
14 years 6 months ago
2004
IEEE
I/O placement has always been a concern in modern IC design. Due to flip-chip technology, I/O can be placed throughout the whole chip without long wires from the periphery of the...
ICCD
2004
IEEE
14 years 6 months ago
2004
IEEE
Leakage current is a key factor in IC power consumption even in the active operating mode. We investigate the simultaneous optimization of gate size and threshold voltage to reduc...
ICCAD
2004
IEEE
14 years 6 months ago
2004
IEEE
Thermal effects are becoming a limiting factor in highperformance circuit design due to the strong temperaturedependence of leakage power, circuit performance, IC package cost and...
ASPDAC
2004
ACM
14 years 3 months ago
2004
ACM
—The routing environment for the new emerging mixed-signal System-on-Package (SOP) technology is more advanced than that of the conventional PCB or MCM technology – pins are lo...