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ICCD
2007
IEEE
161views Hardware» more  ICCD 2007»
14 years 4 months ago
Scan chain design for three-dimensional integrated circuits (3D ICs)
Scan chains are widely used to improve the testability of IC designs. In traditional 2D IC designs, various design techniques on the construction of scan chains have been proposed...
Xiaoxia Wu, Paul Falkenstern, Yuan Xie
ASPDAC
2007
ACM
164views Hardware» more  ASPDAC 2007»
13 years 11 months ago
Thermal-Aware 3D IC Placement Via Transformation
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
Jason Cong, Guojie Luo, Jie Wei, Yan Zhang
BROADNETS
2007
IEEE
14 years 1 months ago
DIMPLE: DynamIc Membership ProtocoL for epidemic protocols
—Epidemic protocols assume that information of a random set of nodes is provided at each protocol round. By definition, the random set needs to be chosen uniformly and randomly ...
Jin Sun, Paul J. Weber, Byung Kyu Choi, Roger M. K...
WWW
2007
ACM
14 years 8 months ago
Bridging the gap between OWL and relational databases
Schema statements in OWL are interpreted quite differently from analogous statements in relational databases. If these statements are meant to be interpreted as integrity constrai...
Boris Motik, Ian Horrocks, Ulrike Sattler
ATAL
2007
Springer
14 years 1 months ago
Online auctions for bidders with interdependent values
Interdependent values (IDV) is a valuation model allowing bidders in an auction to express their value for the item(s) to sell as a function of the other bidders’ information. W...
Florin Constantin, Takayuki Ito, David C. Parkes