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PATMOS
2005
Springer
14 years 1 months ago
2005
Springer
ISCAS
2005
IEEE
14 years 1 months ago
2005
IEEE
—Multi-project wafer (MPW) is commonly used for low-volume IC production. In this paper, we study whether it can be used for medium-volume production. Cost equations are develope...
ICCD
2005
IEEE
14 years 4 months ago
2005
IEEE
The implementation of interconnect is becoming a significant challenge in modern IC design. Both synchronous and asynchronous strategies have been suggested to manage this problem...
AMC
2005
13 years 7 months ago
2005
A constructive algorithm for the completion of arbitrary algebraic partial differential equation systems to involutive ones are presented. Based on it, an implementation ICS for c...
GLVLSI
2005
IEEE
14 years 1 months ago
2005
IEEE
The dependence of the propagation delay of the interlayer 3-D interconnects on the vertical through via location and length is investigated. For a variable vertical through via lo...