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DATE
2005
IEEE
14 years 1 months ago
2005
IEEE
Assessing IC manufacturing process fluctuations and their impacts on IC interconnect performance has become unavoidable for modern DSM designs. However, the construction of parame...
VLSID
2005
IEEE
14 years 8 months ago
2005
IEEE
The electromigration effect within current-density-stressed signal and power lines is an ubiquitous and increasingly important reliability and design problem in sub-micron IC desi...
DAC
2005
ACM
14 years 8 months ago
2005
ACM
As the d esig n-m anu factu ring interface becom es increasing ly com plicated with IC technolog y scaling , the correspond ing process variability poses g reat challeng es for na...
VLSID
2005
IEEE
14 years 1 months ago
2005
IEEE
Abstract—Integrated power supplies are critical building blocks in stateof-the-art portable applications, where they efficiently and accurately transform a battery supply into va...
ASPDAC
2005
ACM
14 years 1 months ago
2005
ACM
3-D IC has a great potential for improving circuit performance and degree of integration. It is also an attractive platform for system-on-chip or system-in-package solutions. A cr...