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MR
2006
73views Robotics» more  MR 2006»
13 years 7 months ago
Reliability of large periphery GaN-on-Si HFETs
S. Singhal, T. Li, A. Chaudhari, A. W. Hanson, R. ...
MR
2007
93views Robotics» more  MR 2007»
13 years 7 months ago
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
The development of a simplified analytical model to describe the thermal history of a Printed Circuit Board assembly (PCA) during convective reflow soldering is described in this ...
Nele Van Steenberge, Paresh Limaye, Geert Willems,...
MR
2007
107views Robotics» more  MR 2007»
13 years 7 months ago
Cohesive zone modeling for structural integrity analysis of IC interconnects
Due to the miniaturization of integrated circuits, their thermo-mechanical reliability tends to become a truly critical design criterion.
B. A. E. van Hal, R. H. J. Peerlings, M. G. D. Gee...