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    2010
    105views Robotics» more  MR 2010»
    Design of differential low-noise amplifier with cross-coupled-SCR ESD protection scheme
    15 years 1 months ago
    Design of differential low-noise amplifier with cross-coupled-SCR ESD protection scheme
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    Chun-Yu Lin, Ming-Dou Ker, Yuan-Wen Hsiao
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    MR
    2006
    73views Robotics» more  MR 2006»
    Reliability of large periphery GaN-on-Si HFETs
    15 years 3 months ago
    Reliability of large periphery GaN-on-Si HFETs
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    S. Singhal, T. Li, A. Chaudhari, A. W. Hanson, R. ...
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    MR
    2006
    75views Robotics» more  MR 2006»
    New experimental findings on hot-carrier-induced degradation in lateral DMOS transistors
    15 years 3 months ago
    New experimental findings on hot-carrier-induced degradation in lateral DMOS transistors
    Download  sdtlab.incheon.ac.kr
    In Kyung Lee, Se Re Na Yun, Kyosun Kim, Chong-Gun ...
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    MR
    2007
    93views Robotics» more  MR 2007»
    Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
    15 years 2 months ago
    Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
    Download  www.imec.be
    The development of a simplified analytical model to describe the thermal history of a Printed Circuit Board assembly (PCA) during convective reflow soldering is described in this ...
    Nele Van Steenberge, Paresh Limaye, Geert Willems,...
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    MR
    2007
    107views Robotics» more  MR 2007»
    Cohesive zone modeling for structural integrity analysis of IC interconnects
    15 years 2 months ago
    Cohesive zone modeling for structural integrity analysis of IC interconnects
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    Due to the miniaturization of integrated circuits, their thermo-mechanical reliability tends to become a truly critical design criterion.
    B. A. E. van Hal, R. H. J. Peerlings, M. G. D. Gee...
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