132 search results - page 4 / 27 » mr 2006 |
MR
2006
13 years 7 months ago
2006
This paper deals with placing chips on an MCM substrate in chip array style for minimizing the system failure rate. The placement procedure begins with constructing an initial pla...
MR
2006
13 years 7 months ago
2006
Interface reliability issue has become a major concern in developing flip chip assembly. The CTE mismatch between different material layers may induce severe interface delaminatio...
MR
2006
13 years 7 months ago
2006
Deuterated oxides exhibit prolonged hot carrier lifetimes at room temperature. We report evidence that this improved hot carrier hardness exists over the temperature range between...
MR
2006
13 years 7 months ago
2006
The intrinsic failure mechanisms and reliability models of state-of-the-art MOSFETs are reviewed. The simulation tools and failure equivalent circuits are described. The review in...
MR
2002
13 years 7 months ago
2002
Gold to Gold Interconnection (GGI) flip chip bonding technology has been developed to bond the driver IC chip on the integrated circuit suspension used in hard disk drives (HDDs)....