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MR
2002
103views Robotics» more  MR 2002»
13 years 7 months ago
ESD protection design for CMOS RF integrated circuits using polysilicon diodes
ESD protection design for CMOS RF integrated circuits is proposed in this paper by using the stacked polysilicon diodes as the input ESD protection devices to reduce the total inp...
Ming-Dou Ker, Chyh-Yih Chang
MR
2002
63views Robotics» more  MR 2002»
13 years 7 months ago
Transient thermal analysis of multilayered structures using Green's functions
This paper presents an approach to the analysis of transient thermal states in electronic circuits using an analytical solution of the heat equation. Fully three-dimensional analy...
Marcin Janicki, Gilbert De Mey, Andrzej Napieralsk...
MR
2002
318views Robotics» more  MR 2002»
13 years 7 months ago
Selected failure mechanisms of modern power modules
This paper reviews the main failure mechanisms occurring in modern power modules paying special attention to insulated gate bipolar transistor devices for high-power applications....
Mauro Ciappa
MR
2002
90views Robotics» more  MR 2002»
13 years 7 months ago
Correlation considerations: Real HBM to TLP and HBM testers
- This paper discusses the previously unexplored initial front rise differences between Real HBM, TLP and HBM tester waveshapes. The dV/dt of the HBM test pulse amplitude below 2% ...
Jon Barth, John Richner
MR
2007
144views Robotics» more  MR 2007»
13 years 7 months ago
Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions
Two extreme configurations under short circuit conditions leading to the punch through Trench IGBT failure under the effect of the temperature and the gate resistance have been st...
A. Benmansour, Stephane Azzopardi, J. C. Martin, E...