ESD protection design for CMOS RF integrated circuits is proposed in this paper by using the stacked polysilicon diodes as the input ESD protection devices to reduce the total inp...
This paper presents an approach to the analysis of transient thermal states in electronic circuits using an analytical solution of the heat equation. Fully three-dimensional analy...
Marcin Janicki, Gilbert De Mey, Andrzej Napieralsk...
This paper reviews the main failure mechanisms occurring in modern power modules paying special attention to insulated gate bipolar transistor devices for high-power applications....
- This paper discusses the previously unexplored initial front rise differences between Real HBM, TLP and HBM tester waveshapes. The dV/dt of the HBM test pulse amplitude below 2% ...
Two extreme configurations under short circuit conditions leading to the punch through Trench IGBT failure under the effect of the temperature and the gate resistance have been st...
A. Benmansour, Stephane Azzopardi, J. C. Martin, E...