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MEMICS
2010
13 years 3 months ago
Monitoring and Control of Temperature in Networks-on-Chip
Abstract. Increasing integration densities and the emergence of nanotechnology cause issues related to reliability and power consumption to become dominant factors for the design o...
Tim Wegner, Claas Cornelius, Andreas Tockhorn, Dir...
ASPDAC
2010
ACM
163views Hardware» more  ASPDAC 2010»
13 years 6 months ago
A3MAP: architecture-aware analytic mapping for networks-on-chip
- In this paper, we propose a novel and global A3MAP (Architecture-Aware Analytic Mapping) algorithm applied to NoC (Networks-on-Chip) based MPSoC (Multi-Processor System-on-Chip) ...
Wooyoung Jang, David Z. Pan
ERSA
2010
172views Hardware» more  ERSA 2010»
13 years 6 months ago
A Self-Reconfigurable Lightweight Interconnect for Scalable Processor Fabrics
Interconnect architecture is a primary research issue for emerging many-core processors. Packet switched Networks-on-Chip (NoCs) are considered key to success but since they delive...
Heiner Giefers, Marco Platzner
LCTRTS
2010
Springer
14 years 3 months ago
Design exploration and automatic generation of MPSoC platform TLMs from Kahn Process Network applications
With increasingly more complex Multi-Processor Systems on Chip (MPSoC) and shortening time-to- market projections, Transaction Level Modeling and Platform Aware Design are seen as...
Ines Viskic, Lochi Lo Chi Yu Lo, Daniel Gajski
DAC
2010
ACM
14 years 14 days ago
Cost-driven 3D integration with interconnect layers
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...
Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna ...