Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
— Most of robotic soft pads studied so far were made with a thick layer of homogeneous material shaped around a rigid core; their behavior has been widely investigated in the lit...
Abstract— In an effort to make processors more power efficient scratch pad memory (SPM) have been proposed instead of caches, which can consume majority of processor power. Howe...
Arun Kannan, Aviral Shrivastava, Amit Pabalkar, Jo...
In this paper, we present a novel flip-chip routing algorithm for package-board co-design. Unlike the previous works that can consider only either free- or pre-assignment routing,...