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ICECCS
2009
IEEE
166views Hardware» more  ICECCS 2009»
13 years 9 months ago
ASIIST: Application Specific I/O Integration Support Tool for Real-Time Bus Architecture Designs
In hard real-time systems such as avionics, computer board level designs are typically customized to meet specific reliability and real time requirements. This paper focuses on co...
Min-Young Nam, Rodolfo Pellizzoni, Lui Sha, Richar...
ICECCS
2009
IEEE
156views Hardware» more  ICECCS 2009»
13 years 9 months ago
Energy Efficient Duty Allocation Protocols for Wireless Sensor Networks
Wireless sensor networks require shared medium access management to prevent collisions, message corruption and other unhelpful effects. Cellular sensornets require minimal energy ...
Jonathan Tate, Iain Bate
ICCAD
2009
IEEE
100views Hardware» more  ICCAD 2009»
13 years 9 months ago
A study of routability estimation and clustering in placement
This paper studies the effects of clustering as a pre-processing step and routability estimation in the placement flow. The study shows that when clustering and routability estima...
Kalliopi Tsota, Cheng-Kok Koh, Venkataramanan Bala...
ICCAD
2009
IEEE
147views Hardware» more  ICCAD 2009»
13 years 9 months ago
SAT-based protein design
Computational protein design can be formulated as an optimization problem, where the objective is to identify the sequence of amino acids that minimizes the energy of a given prot...
Noah Ollikainen, Ellen Sentovich, Carlos Coelho, A...
ICCAD
2009
IEEE
109views Hardware» more  ICCAD 2009»
13 years 9 months ago
CRISP: Congestion reduction by iterated spreading during placement
Dramatic progress has been made in algorithms for placement and routing over the last 5 years, with improvements in both speed and quality. Combining placement and routing into a ...
Jarrod A. Roy, Natarajan Viswanathan, Gi-Joon Nam,...
ICCAD
2009
IEEE
171views Hardware» more  ICCAD 2009»
13 years 9 months ago
A hybrid local-global approach for multi-core thermal management
Multi-core processors have become an integral part of mainstream high performance computer systems. In parallel, exponentially increasing power density and packaging costs have ne...
Ramkumar Jayaseelan, Tulika Mitra
ICCAD
2009
IEEE
136views Hardware» more  ICCAD 2009»
13 years 9 months ago
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Young-Joon Lee, Rohan Goel, Sung Kyu Lim
ICCAD
2009
IEEE
144views Hardware» more  ICCAD 2009»
13 years 9 months ago
Virtual probe: A statistically optimal framework for minimum-cost silicon characterization of nanoscale integrated circuits
In this paper, we propose a new technique, referred to as virtual probe (VP), to efficiently measure, characterize and monitor both inter-die and spatially-correlated intra-die va...
Xin Li, Rob A. Rutenbar, R. D. (Shawn) Blanton
ICCAD
2009
IEEE
121views Hardware» more  ICCAD 2009»
13 years 9 months ago
MOLES: Malicious off-chip leakage enabled by side-channels
Economic incentives have driven the semiconductor industry to separate design from fabrication in recent years. This trend leads to potential vulnerabilities from untrusted circui...
Lang Lin, Wayne Burleson, Christof Paar
ICCAD
2009
IEEE
128views Hardware» more  ICCAD 2009»
13 years 9 months ago
PCRAMsim: System-level performance, energy, and area modeling for Phase-Change RAM
Phase-change random access memory (PCRAM) is an emerging memory technology with attractive features, such as fast read access, high density, and non-volatility. Because of these a...
Xiangyu Dong, Norman P. Jouppi, Yuan Xie