ICCAD
2009
IEEE
13 years 9 months ago
2009
IEEE
In a behavioral synthesis system, a typical approach used to guide the scheduler is to impose hard constraints on the relative timing between operations considering performance, a...
ICCAD
2009
IEEE
13 years 9 months ago
2009
IEEE
Traditional circuit design focuses on optimizing the static critical paths no matter how infrequently these paths are exercised dynamically. Circuit optimization is then tuned to ...
ICCAD
2009
IEEE
13 years 9 months ago
2009
IEEE
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
ICCAD
2009
IEEE
13 years 9 months ago
2009
IEEE
Very thorough online self-test is essential for overcoming major reliability challenges such as early-life failures and transistor aging in advanced technologies. This paper demon...
ICCAD
2009
IEEE
13 years 9 months ago
2009
IEEE
In this paper, an adaptive sampling method is proposed for the statistical SRAM cell analysis. The method is composed of two components. One part is the adaptive sampler that manip...
ICCAD
2009
IEEE
13 years 9 months ago
2009
IEEE
ICCAD
2009
IEEE
13 years 9 months ago
2009
IEEE
Present application specific embedded systems tend to choose instruction set extensions (ISEs) based on limitations imposed by the available data bandwidth to custom functional un...
ICCAD
2009
IEEE
13 years 9 months ago
2009
IEEE
A parallel computing approach for large-scale SPICE-accurate circuit simulation is described that is based on a new preconditioned iterative solver. The preconditioner involves the...
ICCAD
2009
IEEE
13 years 9 months ago
2009
IEEE
Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with prebond testability because designers can avoid stack...
ICCAD
2009
IEEE
13 years 9 months ago
2009
IEEE
-- The importance of within-die process variation and its impact on product yield has increased significantly with scaling. Within-die variation is typically monitored by embedding...