ASPDAC
2008
ACM
14 years 2 months ago
2008
ACM
- With the increasing levels of variability in the behavior of manufactured nano-scale devices and dramatic changes in the power density on a chip, timely identification of hot spo...
ASYNC
1999
IEEE
14 years 5 months ago
1999
IEEE
The counterflow pipeline architecture [12] consists of two interacting pipelines in which data items flow in opposite directions. Interactions occur between two items when they me...
ICES
2001
Springer
14 years 5 months ago
2001
Springer
A system for intrinsic hardware evolution of analog electronic circuits is presented. It consists of a VLSI chip featuring 16 × 16 programmable transistor cells, an FPGA based PCI...
VTS
2005
IEEE
14 years 6 months ago
2005
IEEE
The power supply transient signal (IDDT) method that we propose for defect detection analyze regional signal variations introduced by defects at a set of power supply pads on the ...
IWSOC
2005
IEEE
14 years 6 months ago
2005
IEEE
This paper presents a case study of a single-chip 3G WCDMA/FDD basestation implementation based on a circuit-switched network on chip. As the amount of transistors on a chip conti...
ISCAS
2006
IEEE
14 years 6 months ago
2006
IEEE
Recent years have seen the rapid development of microsensor technology, system on chip design, wireless technology and ubiquitous computing. When assembled into a complex microsys...
CCECE
2006
IEEE
14 years 7 months ago
2006
IEEE
Real Time embedded system designers are facing extreme challenges in underlying architectural design selection. It involves the selection of a programmable, concurrent, heterogene...
ISCA
2007
IEEE
14 years 7 months ago
2007
IEEE
We introduce a novel chip fabrication technique called “brick and mortar”, in which chips are made from small, pre-fabricated ASIC bricks and bonded in a designer-specified a...
ICPP
2008
IEEE
14 years 7 months ago
2008
IEEE
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
FDTC
2009
Springer
14 years 7 months ago
2009
Springer
—This paper shows that optical emissions from an operating chip have a good correlation with power traces and can therefore be used to estimate the contribution of different area...