CORR
2008
Springer
13 years 10 months ago
2008
Springer
In the constraint programming framework, state-of-the-art static and dynamic decomposition techniques are hard to apply to problems with complete initial constraint graphs. For suc...
CORR
2008
Springer
13 years 10 months ago
2008
Springer
Abstract-- A generic intuition says that the pre-log, or multiplexing gain, cannot be larger than the minimum of the number of transmit and receive dimensions. This suggests that f...
CORR
2008
Springer
13 years 10 months ago
2008
Springer
We investigate the behavior of a large number of selfish users that are able to switch dynamically between multiple wireless access-points (possibly belonging to different standard...
CORR
2008
Springer
13 years 10 months ago
2008
Springer
CORR
2008
Springer
13 years 10 months ago
2008
Springer
A novel technique for the fabrication of micro electromagnetic actuators was proposed and a prototype was designed and fabricated in this study. The constituent parts of the design...
CORR
2008
Springer
13 years 10 months ago
2008
Springer
CORR
2008
Springer
13 years 10 months ago
2008
Springer
CORR
2008
Springer
13 years 10 months ago
2008
Springer
CORR
2008
Springer
13 years 10 months ago
2008
Springer
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
CORR
2008
Springer
13 years 10 months ago
2008
Springer
This special session on 3D TSV