DAC
2012
ACM
12 years 3 months ago
2012
ACM
We develop a projected-subgradient primal-dual Lagrange optimization for global placement, that can be instantiated with a variety of interconnect models. It decomposes the origin...
DAC
2011
ACM
13 years 13 days ago
2011
ACM
Variations in delay caused by within-die and die-to-die process variations and SOI history effect increase timing margins and reduce performance. In order to develop mitigation te...
DAC
2011
ACM
13 years 13 days ago
2011
ACM
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
DAC
2011
ACM
13 years 13 days ago
2011
ACM
In the era of deep sub-wavelength lithography for nanometer VLSI designs, manufacturability and yield issues are critical and need to be addressed during the key physical design i...
ICS
2011
Tsinghua U.
13 years 4 months ago
2011
Tsinghua U.
Suppose one is considering purchase of a computer equipped with accelerators. Or suppose one has access to such a computer and is considering porting code to take advantage of the...
DAC
2005
ACM
14 years 2 months ago
2005
ACM
Methodology, EDA Flow, scripts, and documentation plays a tremendous role in the deployment and standardization of advanced design techniques. In this paper we focus not only on l...