Sciweavers

DAC
2007
ACM
15 years 16 days ago
A New Twisted Differential Line Structure in Global Bus Design
Twisted differential line structure can effectively reduce crosstalk noise on global bus, which foresees a wide applicability. However, measured performance based on fabricated ci...
Zhanyuan Jiang, Shiyan Hu, Weiping Shi
DAC
2007
ACM
15 years 16 days ago
Program Mapping onto Network Processors by Recursive Bipartitioning and Refining
Mapping packet processing applications onto embedded network processors (NP) is a challenging task due to the unique constraints of NP systems and the characteristics of network a...
Jia Yu, Jingnan Yao, Jun Yang 0002, Laxmi N. Bhuya...
DAC
2007
ACM
15 years 16 days ago
Period Optimization for Hard Real-time Distributed Automotive Systems
The complexity and physical distribution of modern active-safety automotive applications requires the use of distributed architectures. These architectures consist of multiple ele...
Abhijit Davare, Qi Zhu, Marco Di Natale, Claudio P...
DAC
2007
ACM
15 years 16 days ago
Enhancing FPGA Performance for Arithmetic Circuits
FPGAs offer flexibility and cost-effectiveness that ASICs cannot match; however, their performance is quite poor in comparison, especially for arithmetic dominated circuits. To ad...
Philip Brisk, Ajay K. Verma, Paolo Ienne, Hadi Par...
DAC
2007
ACM
15 years 16 days ago
Multi-Core Design Automation Challenges
The trend to multi-core chip designs presents new challenges for design automation, while the increased reuse of components may offer solutions. This paper describes some of the k...
John A. Darringer
DAC
2007
ACM
15 years 16 days ago
Optimization of Area in Digital FIR Filters using Gate-Level Metrics
In the paper, we propose a new metric for the minimization of area in the generic problem of multiple constant multiplications, and demonstrate its effectiveness for digital FIR f...
Eduardo A. C. da Costa, José C. Monteiro, L...
DAC
2007
ACM
15 years 16 days ago
Nanometer Device Scaling in Subthreshold Circuits
Scott Hanson, Mingoo Seok, Dennis Sylvester, David...
DAC
2007
ACM
15 years 16 days ago
Placement of 3D ICs with Thermal and Interlayer Via Considerations
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
Brent Goplen, Sachin S. Sapatnekar
DAC
2007
ACM
15 years 16 days ago
Design Methodology for Pipelined Heterogeneous Multiprocessor System
Multiprocessor SoC systems have led to the increasing use of parallel hardware along with the associated software. These approaches have included coprocessor, homogeneous processo...
Seng Lin Shee, Sri Parameswaran