CORR
2008
Springer
13 years 8 months ago
2008
Springer
CORR
2008
Springer
13 years 8 months ago
2008
Springer
CORR
2008
Springer
13 years 8 months ago
2008
Springer
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
CORR
2010
Springer
13 years 8 months ago
2010
Springer
In this paper, we provide a new achievable ergodic secrecy rate region for the multiple access wiretap channel in fading. Our achievable scheme is based on repeating each symbol at...
CORR
2008
Springer
13 years 8 months ago
2008
Springer
This special session on 3D TSV
CORR
2010
Springer
13 years 8 months ago
2010
Springer
In an undirected graph G = (V, E), a subset C V such that C is a dominating set of G, and each vertex in V is dominated by a distinct subset of vertices from C, is called an iden...
CORR
2008
Springer
13 years 8 months ago
2008
Springer
Abstract-Two dimensional (2D) integration has been the traditional approach for IC integration. Increasing demands for providing electronic devices with superior performance and fu...
CORR
2010
Springer
13 years 8 months ago
2010
Springer
Takens' Embedding Theorem remarkably established that concatenating M previous outputs of a dynamical system into a vector (called a delay coordinate map) can be a one-to-one...
CORR
2008
Springer
13 years 8 months ago
2008
Springer
This study investigates a high Q-factor spiral inductor fabricated by the CMOS (complementary metal oxide semiconductor) process and a post-process. The spiral inductor is manufact...
CORR
2010
Springer
13 years 8 months ago
2010
Springer
We study the problem of Upward Point-Set Embeddability, that is the problem of deciding whether a given upward planar digraph D has an upward planar embedding into a point set S. W...