Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
Very thorough online self-test is essential for overcoming major reliability challenges such as early-life failures and transistor aging in advanced technologies. This paper demon...
In this paper, an adaptive sampling method is proposed for the statistical SRAM cell analysis. The method is composed of two components. One part is the adaptive sampler that manip...
Present application specific embedded systems tend to choose instruction set extensions (ISEs) based on limitations imposed by the available data bandwidth to custom functional un...
Panagiotis Athanasopoulos, Philip Brisk, Yusuf Leb...
A parallel computing approach for large-scale SPICE-accurate circuit simulation is described that is based on a new preconditioned iterative solver. The preconditioner involves the...
Heidi Thornquist, Eric R. Keiter, Robert J. Hoekst...
Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with prebond testability because designers can avoid stack...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...
-- The importance of within-die process variation and its impact on product yield has increased significantly with scaling. Within-die variation is typically monitored by embedding...
Double patterning technology (DPT) has emerged as the most hopeful candidate for the next technology node of the ITRS roadmap [1]. The goal of a DPT decomposer is to decompose the...
Power gating has been a very effective way to reduce leakage power. One important design issue for a power gating design is to limit the surge current during the wakeup process. N...