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30

ICCAD
2009
IEEE

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A study of Through-Silicon-Via impact on the 3D stacked IC layout

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A study of Through-Silicon-Via impact on the 3D stacked IC layout

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Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim

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Added	18 Feb 2011
Updated	18 Feb 2011
Type	Journal
Year	2009
Where	ICCAD
Authors	Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim

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