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    A study of Through-Silicon-Via impact on the 3D stacked IC layout

    13 years 9 months ago
    A study of Through-Silicon-Via impact on the 3D stacked IC layout
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    Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim
    claim paper
    Added 18 Feb 2011
    Updated 18 Feb 2011
    Type Journal
    Year 2009
    Where ICCAD
    Authors Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim
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