— Since re-designing and re-optimizing existing logic, memory, and IP blocks in a 3D fashion significantly increases design cost, nearterm three-dimensional integrated circuit (...
In 2001, Shimozono and White gave a description of the domino Schensted algorithm of Barbasch, Vogan, Garfinkle and van Leeuwen with the "color-to-spin" property, that i...
Abstract— 3D circuits have the potential to improve performance over traditional 2D circuits by reducing wirelength and interconnect delay. One major problem with 3D circuits is ...
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highl...