DAC
2011
ACM
12 years 7 months ago
2011
ACM
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...
DAC
2011
ACM
12 years 7 months ago
2011
ACM
In this paper, a new sparse approximation technique is proposed for incremental power grid analysis. Our proposed method is motivated by the observation that when a power grid net...
ISPD
2011
ACM
12 years 10 months ago
2011
ACM
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
FPGA
2011
ACM
12 years 11 months ago
2011
ACM
In this paper, we introduce a new open source high-level synthesis tool called LegUp that allows software techniques to be used for hardware design. LegUp accepts a standard C pro...