DAC
2012
ACM
12 years 2 months ago
2012
ACM
We develop a projected-subgradient primal-dual Lagrange optimization for global placement, that can be instantiated with a variety of interconnect models. It decomposes the origin...
DAC
2012
ACM
12 years 2 months ago
2012
ACM
Large-scale process variations can significantly limit the practical utility of microelectro-mechanical systems (MEMS) for RF (radio frequency) applications. In this paper we desc...
DAC
2012
ACM
12 years 2 months ago
2012
ACM
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
ISPD
2012
ACM
12 years 8 months ago
2012
ACM
Importance sampling is a popular approach to estimate rare event failures of SRAM cells. We propose to improve importance sampling by probability collectives. First, we use “Kul...
ISPD
2012
ACM
12 years 8 months ago
2012
ACM
As technology scales and frequency increases, a new design style is emerging, referred to as hybrid designs, which contain a mixture of random logic and datapath standard cell com...
ISPD
2012
ACM
12 years 8 months ago
2012
ACM
Gate sizing in VLSI design is a widely-used method for power or area recovery subject to timing constraints. Several previous works have proposed gate sizing heuristics for power ...
DAC
2011
ACM
13 years 7 days ago
2011
ACM
Clock tree synthesis is one of the most important and challenging problems in 3D ICs. The clock signals have to be delivered by through-silicon vias (TSVs) to different tiers with...
DAC
2011
ACM
13 years 7 days ago
2011
ACM
Stochastic device noise has become a significant challenge for high-precision analog/RF circuits, and it is particularly difficult to correctly include both white noise and flic...
DAC
2011
ACM
13 years 7 days ago
2011
ACM
SRAM design has been a major challenge for nanoscale manufacturing technology. We propose a new bit cell repair scheme for designing maximum-information memory system (MIMS). Unli...
DAC
2011
ACM
13 years 7 days ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...