Sciweavers

    MR
    2006
    92views Robotics» more  MR 2006»
    Failure mechanism of trench IGBT under short-circuit after turn-off
    14 years 2 months ago
    Failure mechanism of trench IGBT under short-circuit after turn-off
    Download  hal.archives-ouvertes.fr
    Power semiconductor devices under short-circuit are submitted to high current and high voltage simultaneously that induce high electrical and thermal stresses. Several types of ev...
    A. Benmansour, Stephane Azzopardi, J. C. Martin, E...
    claim paper
    Read More »
    MR
    2006
    57views Robotics» more  MR 2006»
    Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading
    14 years 2 months ago
    Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading
    Download  www3.ntu.edu.sg
    Interface reliability issue has become a major concern in developing flip chip assembly. The CTE mismatch between different material layers may induce severe interface delaminatio...
    Y. L. Zhang, D. X. Q. Shi, W. Zhou
    claim paper
    Read More »
    MR
    2006
    80views Robotics» more  MR 2006»
    A 3D analysis technique for detecting trace metal contamination
    14 years 2 months ago
    A 3D analysis technique for detecting trace metal contamination
    Download  www-lsits.ist.osaka-u.ac.jp
    Yasunori Goto, Tomokatsu Higuchi
    claim paper
    Read More »
    MR
    2006
    74views Robotics» more  MR 2006»
    Lock-in thermal IR imaging using a solid immersion lens
    14 years 2 months ago
    Lock-in thermal IR imaging using a solid immersion lens
    Download  www.mpi-halle.de
    A hemispherical silicon solid immersion lens (SIL) was used to improve the spatial resolution of front-side thermal IR imaging in lock-in mode. The bottom of the SIL was cone-shap...
    O. Breitenstein, F. Altmann, T. Riediger, D. Karg,...
    claim paper
    Read More »
    MR
    2006
    70views Robotics» more  MR 2006»
    Thermal characterization and modeling of power hybrid converters for distributed power systems
    14 years 2 months ago
    Thermal characterization and modeling of power hybrid converters for distributed power systems
    Download  www2.unipr.it
    Paolo Cova, Nicola Delmonte, Roberto Menozzi
    claim paper
    Read More »
    MR
    2006
    71views Robotics» more  MR 2006»
    High-temperature reliability of Flip Chip assemblies
    14 years 2 months ago
    High-temperature reliability of Flip Chip assemblies
    Download  www.cie-info.org.cn
    T. Braun, K.-F. Becker, M. Koch, V. Bader, Rolf As...
    claim paper
    Read More »
    MR
    2006
    118views Robotics» more  MR 2006»
    Single event burnout in power diodes: Mechanisms and models
    14 years 2 months ago
    Single event burnout in power diodes: Mechanisms and models
    Download  tplab.vuse.vanderbilt.edu
    Power electronic devices are susceptible to catastrophic failures when they are exposed to energetic particles; the most serious failure mechanism is single event burnout (SEB). S...
    A. M. Albadri, Ronald D. Schrimpf, Kenneth F. Gall...
    claim paper
    Read More »
    MR
    2006
    73views Robotics» more  MR 2006»
    A MAIC approach to TFT-LCD panel quality improvement
    14 years 2 months ago
    A MAIC approach to TFT-LCD panel quality improvement
    Download  ir.lib.ncut.edu.tw
    The liquid crystal displays (LCDs) possess the most mature technology and best consuming competitiveness in the flat panel display (FPD) industries. Of all the LCDs, thin film tra...
    K. S. Chen, C. H. Wang, H. T. Chen
    claim paper
    Read More »
    MR
    2006
    65views Robotics» more  MR 2006»
    Electromigration lifetimes and void growth at low cumulative failure probability
    14 years 2 months ago
    Electromigration lifetimes and void growth at low cumulative failure probability
    Download  www.electronics.uni-wuppertal.de
    We studied electromigration (EM) lifetimes and void growth at low cumulative failure probability. We carried out EM test in damascene Cu lines using sudden-death type test structu...
    Hideaki Tsuchiya, Shinji Yokogawa
    claim paper
    Read More »
    MR
    2006
    72views Robotics» more  MR 2006»
    A reliability-driven placement procedure based on thermal-force model
    14 years 2 months ago
    A reliability-driven placement procedure based on thermal-force model
    Download  ir.lib.stut.edu.tw
    This paper deals with placing chips on an MCM substrate in chip array style for minimizing the system failure rate. The placement procedure begins with constructing an initial pla...
    Jing Lee
    claim paper
    Read More »
    « first‹ previous12
    Explore & Download
    Proceedings Preprints Top 5 Ranked Papers Publications Books Software Tutorials Presentations Lectures Notes Datasets
    Productivity Tools
    International On-screen Keyboard Graphical Social Symbols OCR Text Recognition CSS3 Style Generator Web Page to PDF Web Page to Image PDF Split PDF Merge Latex Equation Editor Sci2ools
    Document Tools
    PDF to Text PDF to Postscript PDF to Thumbnails Excel to PDF Word to PDF Postscript to PDF PowerPoint to PDF Latex to Word Repair Corrupted PDF
    Image Tools
    JPG to PS JPG to PDF Extract Images from PDF Image Converter
    Sciweavers
    About Community Cookies Privacy Policy Terms of Use

    Copyright © Sciweavers LLC, 2009-2025, USA.