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In this paper, we propose a novel framework for fast multilevel routing considering crosstalk and performance optimization. To handle the crosstalk minimization problem, we incorp...
Tsung-Yi Ho, Yao-Wen Chang, Sao-Jie Chen, D. T. Le...
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
As technology advances into the nanometer territory, the interconnect delay has become a first-order effect on chip performance. To handle this effect, the X-architecture has been...