GLVLSI
2010
IEEE
14 years 5 months ago
2010
IEEE
Next generation industrial embedded platforms require the development of complex power and thermal management solutions. Indeed, an increasingly fine and intrusive thermal contro...
DSD
2009
IEEE
14 years 7 months ago
2009
IEEE
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...