GLVLSI
2010
IEEE
14 years 7 months ago
2010
IEEE
The development of compiler-based mechanisms to reduce the percentage of hotspots and optimize the thermal profile of large register files has become an important issue. Thermal...
ISQED
2006
IEEE
14 years 8 months ago
2006
IEEE
The increase in packing density has led to a higher power density in the chip which in turn has led to an increase in temperature on the chip. Temperature affects reliability, per...
ASPDAC
2009
ACM
14 years 8 months ago
2009
ACM
— Thermal balancing and reducing hot-spots are two important challenges facing the MPSoC designers. In this work, we model the thermal behavior of a MPSoC as a control theory pro...