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ASPDAC
2006
ACM

Electrothermal analysis and optimization techniques for nanoscale integrated circuits

14 years 4 months ago
Electrothermal analysis and optimization techniques for nanoscale integrated circuits
Abstract— With technology scaling, on-chip power densities are growing steadily, leading to the point where temperature has become an important consideration in the design of electrical circuits. This paper overviews several methods for the analysis and optimization of thermal effects in integrated circuits. Thermal analysis may be carried out efficiently through the use of finite difference methods, finite element methods, or Green function based methods, each of which provides different accuracycomputation tradeoffs, and the paper begins by surveying these. Next, we overview a restricted set of thermal optimization methods, specifically, placement techniques for thermal heat-spreading, and then we conclude by summarizing a set of future directions in electrothermal design.
Yong Zhan, Brent Goplen, Sachin S. Sapatnekar
Added 13 Jun 2010
Updated 13 Jun 2010
Type Conference
Year 2006
Where ASPDAC
Authors Yong Zhan, Brent Goplen, Sachin S. Sapatnekar
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