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30

DATE
2000
IEEE

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Yield Improvement and Repair Trade-Off for Large Embedded Memories

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Yield Improvement and Repair Trade-Off for Large Embedded Memories

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In this paper, we give an overview of the trade-off to improve yield and optimize silicon manufacturing cost. The specific technology focus is on large embedded memories in complex ASIC or system-on-chip designs. Embedded capabilities for test, redundancy analysis and repair are shown as design-for-manufacturability features needed for large embedded memories in VDSM design.

Yervant Zorian

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DATE 2000 | Hardware | Large Embedded Memories | Silicon Manufacturing Cost | Specific Technology Focus |

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Added	30 Jul 2010
Updated	30 Jul 2010
Type	Conference
Year	2000
Where	DATE
Authors	Yervant Zorian

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