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MAM
2006

A high throughput 3D-bus interconnect for network processors

13 years 11 months ago
A high throughput 3D-bus interconnect for network processors
Deep layer processing and increasing line rates present a memory challenge to processor
Taskin Koçak, Jacob Engel
Added 14 Dec 2010
Updated 14 Dec 2010
Type Journal
Year 2006
Where MAM
Authors Taskin Koçak, Jacob Engel
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