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» A high throughput 3D-bus interconnect for network processors
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MAM
2006
92views more  MAM 2006»
13 years 10 months ago
A high throughput 3D-bus interconnect for network processors
Deep layer processing and increasing line rates present a memory challenge to processor
Taskin Koçak, Jacob Engel
DAC
2008
ACM
14 years 12 months ago
An area-efficient high-throughput hybrid interconnection network for single-chip parallel processing
Single-chip parallel processing requires high bandwidth between processors and on-chip memory modules. A recently proposed Mesh-of-Trees (MoT) network provides high throughput and...
Aydin O. Balkan, Gang Qu, Uzi Vishkin
NOCS
2009
IEEE
14 years 5 months ago
A GALS many-core heterogeneous DSP platform with source-synchronous on-chip interconnection network
This paper presents a many-core heterogeneous computational platform that employs a GALS compatible circuit-switched on-chip network. The platform targets streaming DSP and embedd...
Anh T. Tran, Dean Truong, Bevan M. Baas
DATE
2003
IEEE
180views Hardware» more  DATE 2003»
14 years 4 months ago
Communication Centric Architectures for Turbo-Decoding on Embedded Multiprocessors
Software implementations of channel decoding algorithms are attractive for communication systems with their large variety of existing and emerging standards due to their flexibil...
Frank Gilbert, Michael J. Thul, Norbert Wehn
ISCA
2003
IEEE
112views Hardware» more  ISCA 2003»
14 years 4 months ago
A Pipelined Memory Architecture for High Throughput Network Processors
Designing ASICs for each new generation of backbone routers is a time intensive and fiscally draining process. In this paper we focus on the design of a programmable architecture...
Timothy Sherwood, George Varghese, Brad Calder