Design for manufacturability in submicron domain

- Key characteristics of newly emerging IC technologies render the traditional concept of die size minimization and traditional "design rules" insufficient to handle the design-manufacturing interface. This tutorial surveys the design and process characteristics relevant to the manufacturability of submicron ICs. The discussion also covers analysis of design for manufacturability (DFM) tradeoffs. Yield and cost models needed to analyze these trade-offs are explained as well.

• Type: Conference
• Year: 1996
• Where: ICCAD
• Authors: Wojciech Maly, Hans T. Heineken, Jitendra Khare, Pranab K. Nag
• Keywords: Die Size Minimization, Hardware, ICCAD 1996, Key Characteristics, Submicron Ics