Yield Improvement and Repair Trade-Off for Large Embedded Memories

In this paper, we give an overview of the trade-off to improve yield and optimize silicon manufacturing cost. The specific technology focus is on large embedded memories in complex ASIC or system-on-chip designs. Embedded capabilities for test, redundancy analysis and repair are shown as design-for-manufacturability features needed for large embedded memories in VDSM design.

• Type: Conference
• Year: 2000
• Where: DATE
• Authors: Yervant Zorian
• Keywords: DATE 2000, Hardware, Large Embedded Memories, Silicon Manufacturing Cost, Specific Technology Focus