10 search results - page 1 / 2 » 3D Stacked Microprocessor: Are We There Yet |
MICRO
2010
IEEE
13 years 5 months ago
2010
IEEE
MICRO
2006
IEEE
14 years 1 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
GLVLSI
2006
IEEE
14 years 1 months ago
2006
IEEE
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
VLSID
2010
IEEE
13 years 5 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
MICRO
2008
IEEE
14 years 1 months ago
2008
IEEE
— As semiconductor processing techniques continue to scale down, transient faults, also known as soft errors, are increasingly becoming a reliability threat to high-performance m...