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ICCAD
2003
IEEE
145views Hardware» more  ICCAD 2003»
14 years 5 months ago
Manufacturing-Aware Physical Design
Ultra-deep submicron manufacturability impacts physical design (PD) through complex layout rules and large guardbands for process variability; this creates new requirements for ne...
Puneet Gupta, Andrew B. Kahng
MHCI
2004
Springer
14 years 1 months ago
Mobile Context Aware Systems: The Intelligence to Support Tasks and Effectively Utilise Resources
: The complex usage of mobile devices coupled with their limited resources in terms of display and processing suggests that being able to understand the context of the user would b...
Russell Beale, Peter Lonsdale
NANONET
2009
Springer
199views Chemistry» more  NANONET 2009»
14 years 1 months ago
Through Silicon Via-Based Grid for Thermal Control in 3D Chips
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
José L. Ayala, Arvind Sridhar, Vinod Pangra...
ICASSP
2010
IEEE
13 years 8 months ago
High order motion interpolation for side information improvement in DVC
A key step in distributed video coding is the generation of the side information (SI) i.e. the estimation of the Wyner-Ziv frame (WZF). This step is also frequently called image i...
Giovanni Petrazzuoli, Marco Cagnazzo, Béatr...
AMAI
2007
Springer
13 years 8 months ago
Relational concept discovery in structured datasets
Relational datasets, i.e., datasets in which individuals are described both by their own features and by their relations to other individuals, arise from various sources such as d...
Marianne Huchard, Mohamed Rouane Hacene, Cyril Rou...