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JOLPE
2008
39views more  JOLPE 2008»
13 years 7 months ago
A Fast Architecture-Level Thermal Analysis Method for Runtime Thermal Regulation
Sheldon X.-D. Tan, Pu Liu, Lin Jiang, Wei Wu, Murl...
ICCAD
2005
IEEE
134views Hardware» more  ICCAD 2005»
14 years 29 days ago
Fast thermal simulation for architecture level dynamic thermal management
As power density increases exponentially, runtime regulation of operating temperature by dynamic thermal managements becomes necessary. This paper proposes a novel approach to the...
Pu Liu, Zhenyu Qi, Hang Li, Lingling Jin, Wei Wu, ...
ICCD
2005
IEEE
131views Hardware» more  ICCD 2005»
14 years 29 days ago
Efficient Thermal Simulation for Run-Time Temperature Tracking and Management
As power density increases exponentially, run-time regulation of operating temperature by dynamic thermal management becomes imperative. This paper proposes a novel approach to re...
Hang Li, Pu Liu, Zhenyu Qi, Lingling Jin, Wei Wu, ...
ISCA
2003
IEEE
168views Hardware» more  ISCA 2003»
14 years 19 days ago
Temperature-Aware Microarchitecture
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakuma...
MJ
2011
288views Multimedia» more  MJ 2011»
13 years 2 months ago
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
Pablo Garcia Del Valle, David Atienza