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ICCAD
2009
IEEE
136views Hardware» more  ICCAD 2009»
13 years 5 months ago
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Young-Joon Lee, Rohan Goel, Sung Kyu Lim
EUROSYS
2006
ACM
14 years 4 months ago
Using queries for distributed monitoring and forensics
Distributed systems are hard to build, profile, debug, and test. Monitoring a distributed system – to detect and analyze bugs, test for regressions, identify fault-tolerance pr...
Atul Singh, Petros Maniatis, Timothy Roscoe, Peter...
ICCAD
2005
IEEE
127views Hardware» more  ICCAD 2005»
14 years 4 months ago
Flip-flop insertion with shifted-phase clocks for FPGA power reduction
— Although the LUT (look-up table) size of FPGAs has been optimized for general applications, complicated designs may contain a large number of cascaded LUTs between flip-flops...
Hyeonmin Lim, Kyungsoo Lee, Youngjin Cho, Naehyuck...
MOBICOM
2006
ACM
14 years 1 months ago
Boundary recognition in sensor networks by topological methods
Wireless sensor networks are tightly associated with the underlying environment in which the sensors are deployed. The global topology of the network is of great importance to bot...
Yue Wang, Jie Gao, Joseph S. B. Mitchell
MOBICOM
2006
ACM
14 years 1 months ago
Low-cost communication for rural internet kiosks using mechanical backhaul
Rural kiosks in developing countries provide a variety of services such as birth, marriage, and death certificates, electricity bill collection, land records, email services, and...
Aaditeshwar Seth, D. Kroeker, Matei A. Zaharia, Sh...