Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Distributed systems are hard to build, profile, debug, and test. Monitoring a distributed system – to detect and analyze bugs, test for regressions, identify fault-tolerance pr...
— Although the LUT (look-up table) size of FPGAs has been optimized for general applications, complicated designs may contain a large number of cascaded LUTs between flip-flops...
Wireless sensor networks are tightly associated with the underlying environment in which the sensors are deployed. The global topology of the network is of great importance to bot...
Rural kiosks in developing countries provide a variety of services such as birth, marriage, and death certificates, electricity bill collection, land records, email services, and...
Aaditeshwar Seth, D. Kroeker, Matei A. Zaharia, Sh...