As CMOS feature sizes venture deep into the nanometer regime, wearout mechanisms including negative-bias temperature instability and timedependent dielectric breakdown can severely...
Shuguang Feng, Shantanu Gupta, Amin Ansari, Scott ...
—The sustained push for performance, transistor count, and instruction level parallelism has reached a point where chip level power density issues are at the forefront of design ...
Translation Lookaside Buffers (TLBs) are a staple in modern computer systems and have a significant impact on overall system performance. Numerous prior studies have addressed TL...
Chip multiprocessors (CMPs) are expected to be the building blocks for future computer systems. While architecting these emerging CMPs is a challenging problem on its own, program...
Ozcan Ozturk, Mahmut T. Kandemir, Mary Jane Irwin,...
In chip multiprocessors (CMPs), data accesslatency dependson the memory hierarchy organization, the on-chip interconnect (NoC), and the running workload. Reducing data access late...