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DAC
2011
ACM
12 years 7 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
VLSID
2002
IEEE
132views VLSI» more  VLSID 2002»
14 years 8 months ago
VLSI Architecture for a Flexible Motion Estimation with Parameters
If motion estimation can choose the most suitable algorithm according to the changing characteristics of input image signals, we can get benefits, which improve quality and perfor...
Jinku Choi, Nozomu Togawa, Masao Yanagisawa, Tatsu...
PPSC
1993
13 years 9 months ago
Design of a Parallel Nonsymmetric Eigenroutine Toolbox, Part I
The dense nonsymmetric eigenproblem is one of the hardest linear algebra problems to solvee ectively on massivelyparallel machines. Rather than trying to design a black box" ...
Zhaojun Bai, James Demmel
CHI
2002
ACM
14 years 8 months ago
Polyarchy visualization: visualizing multiple intersecting hierarchies
Hierarchy visualization has been a hot topic in the Information Visualization community for the last decade. An emerging new information structure is multiple intersecting hierarc...
George G. Robertson, Kim Cameron, Mary Czerwinski,...
DAC
2004
ACM
14 years 9 months ago
Defect tolerant probabilistic design paradigm for nanotechnologies
Recent successes in the development and self-assembly of nanoelectronic devices suggest that the ability to manufacture dense nanofabrics is on the near horizon. However, the trem...
Margarida F. Jacome, Chen He, Gustavo de Veciana, ...