The design and analysis of today’s complex real-time systems requires advanced methods. Due to ever growing functionality, hardware complexity and component interaction, applyin...
In future large-scale multi-core microprocessors, hard errors and process variations will create dynamic heterogeneity, causing performance and power characteristics to differ amo...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Embedded systems with heterogeneous processors extend the energy/timing trade-off flexibility and provide the opportunity to fine tune resource utilization for particular applicat...
Michel Goraczko, Jie Liu, Dimitrios Lymberopoulos,...
In the Sesame framework, we develop a modeling and simulation environment for the efficient design space exploration of heterogeneous embedded systems. Since Sesame recognizes se...