Abstract-- Process scaling and higher leakage power have resulted in increased power densities and elevated die temperatures. Due to the interdependence of temperature and leakage ...
Aseem Gupta, Nikil D. Dutt, Fadi J. Kurdahi, Kamal...
: This paper presents a novel approach to efficiently perform early system level design space exploration (DSE) of MultiProcessor System-on-Chip (MPSoC) based embedded systems. By...
With increasingly more complex Multi-Processor Systems on Chip (MPSoC) and shortening time-to- market projections, Transaction Level Modeling and Platform Aware Design are seen as...
In the last few years the embedded systems design discipline required new design methodologies and new specification languages to support system engineers in developing heterogen...
Complex embedded systems consist of hardware and software components from different domains, such as control and signal processing, many of them supplied by different IP vendors. ...