353 search results - page 9 / 71 » Accelerating 3D Convolution Using Graphics Hardware |
ASPDAC
2009
ACM
14 years 3 months ago
2009
ACM
ICCAD
2001
IEEE
14 years 6 months ago
2001
IEEE
A mixed potential integral equation (MPIE) technique combined with fast multi-layer Green’s functions and Gaussian Jacobi high order techniques is used to compute the 3-D freque...
ICCAD
2010
IEEE
13 years 7 months ago
2010
IEEE
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
VISSYM
2003
13 years 10 months ago
2003
For volume rendering of regular grids the display of view-plane aligned slices has proven to yield both good quality and performance. In this paper we demonstrate how to merge the...
ISWC
1997
IEEE
14 years 1 months ago
1997
IEEE
We describe a prototype system that combines together the overlaid 3D graphics of augmented reality with the untethered freedom of mobile computing. The goal is to explore how the...