130 search results - page 7 / 26 » Accurate and scalable reliability analysis of logic circuits |
ICCAD
2006
IEEE
14 years 4 months ago
2006
IEEE
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
ICCAD
2009
IEEE
13 years 4 months ago
2009
IEEE
The problem of calculating accurate impact of crosstalk on a circuit considering its inherent logic and timing properties is very complex. Although it has been widely studied, it ...
GLVLSI
2006
IEEE
14 years 1 months ago
2006
IEEE
This paper presents a systematic design methodology for yield enhancement of asynchronous logic circuits using 3-D (3-Dimensional) integration technology. In this design, the targ...
GLVLSI
2007
IEEE
13 years 11 months ago
2007
IEEE
Reliability modeling and evaluation is expected to be one of the major issues in emerging nano-devices and beyond 22nm CMOS. Such devices would have inherent propensity for gate f...
DAC
2000
ACM
14 years 8 months ago
2000
ACM
A dynamic noise model is developed and applied to analyze the noise immunity of precharge-evaluate circuits. Considering that the primary source of noise-injection in the circuit ...