—Variations of process parameters have an important impact on reliability and yield in deep sub micron IC technologies. One methodology to estimate the influence of these effects...
Background: The estimation of the difference between two evolutionary distances within a triplet of homologs is a common operation that is used for example to determine which of t...
Christophe Dessimoz, Manuel Gil, Adrian Schneider,...
The nonuniform substrate thermal profile and process variations are two major concerns in the present-day ultradeep submicrometer designs. To correctly predict performance/ leakage...
The multiple-supply voltage (MSV) design style has been extensively applied to mitigate dynamic-power consumption. The MSV design paradigm, however, brings many crucial challenges...
—This paper introduces a technique to measure and adjust the relative phase of on-chip high speed digital signals using a random sampling technique of inferential statistics. The...