Inductive cross-talk within IC packaging is becoming a significant bottleneck in high-speed inter-chip communication. The parasitic inductance within IC packaging causes bounce o...
On-chip L1 and L2 caches represent a sizeable fraction of the total power consumption of microprocessors. In deep sub-micron technology, the subthreshold leakage power is becoming...
This paper addresses the problem of power-optimal repeater insertion for global buses in the presence of crosstalk noise. MTCMOS technique by inserting high-Vth sleep transistors ...
New embedded systems offer rich power management features in the form of multiple operational and non-operational power modes. While they offer mechanisms for better energy effic...
This paper addresses the problem of reactive power dispatch in a power system partitioned into several areas controlled by different transmission system operators. Previous resear...
Yannick Phulpin, Miroslav Begovic, Marc Petit, Dam...